Redwood City, CA, United States of America

Ryan Michael Dimick

This inventor holds 1 USPTO granted patent. Top assignee: Dusty Robotics, Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ryan Michael Dimick. Retrieved from https://idiyas.com/inventor/ryan-michael-dimick

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Ryan Michael Dimick and Dual-Stage Control for Construction Printing Robots.

Introduction

Ryan Michael Dimick is an inventor associated with Dusty Robotics, Inc., in Redwood City, California. His patent work addresses precise robotic printing of layouts at construction sites.

Latest Patents

Dimick is named on 1 patent: “System and Method for Dual Stage Control of Field Printer Robot.” The invention applies a dual-input, single-output controller to a differential-drive robot equipped with a separately controlled linear actuator. The robot’s steering provides a slower stage, while the actuator moves the print head laterally as a faster stage. By coordinating these movements, the controller aims to achieve rapid convergence and sub-millimeter tracking accuracy. Simulations and experimental results demonstrate the approach’s effectiveness.

Career Highlights

Dimick’s listed patent reflects work on robotic control systems for construction-site layout printing. The design coordinates robot steering and print-head positioning to improve the accuracy of printed layouts.

Collaborations

Dimick’s listed coworkers include Sohum Misra and William Charles Messner. His patent is associated with Dusty Robotics, Inc.

Conclusion

Ryan Michael Dimick’s patent describes a coordinated control method intended to help construction-printing robots place layouts with high precision.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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