Ryan Mesch

Title: Ryan Mesch - Innovator in 3D Embedded Redistribution Layers

Introduction

Ryan Mesch is a notable inventor based in Phoenix, AZ (US). He has made significant contributions to the field of integrated circuit packaging. His innovative work focuses on improving the structures of redistribution layers for integrated circuits and system-on-chip packages.

Latest Patents

Ryan Mesch holds 1 patent for his invention titled "3D embedded redistribution layers for IC substrate packaging." This patent discloses improved redistribution layer structures that feature self-aligning via landing pads and interconnects. The self-alignment allows for pads that terminate non-stacked vias to have decreased widths or diameters without requiring extra capture space. The vias in these redistribution layers are designed with vertical or near-vertical sidewalls, and they can come in various shapes, widths, or lengths. Additionally, the traces in the redistribution layers may have different lengths and shapes, extending into layers that route the vias to enhance metal density.

Career Highlights

Ryan Mesch is currently employed at Apple Inc., where he continues to innovate in the field of integrated circuit technology. His work has contributed to advancements in packaging solutions that are crucial for modern electronic devices.

Collaborations

Ryan collaborates with Jun Chung Hsu, a fellow innovator in the same field. Their partnership enhances the development of cutting-edge technologies in integrated circuit packaging.

Conclusion

Ryan Mesch is a prominent inventor whose work on 3D embedded redistribution layers has the potential to revolutionize integrated circuit packaging. His contributions at Apple Inc. and his innovative patent reflect his commitment to advancing technology in this critical area.