Shanghai, China

Ryan Menglei Liang

This inventor holds 1 USPTO granted patent. Top assignee: Emc IP Holding Company LLC. Active years: 2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ryan Menglei Liang. Retrieved from https://idiyas.com/inventor/ryan-menglei-liang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2020

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1 patent (USPTO):Explore Patents

Title: Ryan Menglei Liang: Innovator in Storage Cluster Technology

Introduction

Ryan Menglei Liang is a notable inventor based in Shanghai, China. He has made significant contributions to the field of storage technology. His innovative approach has led to the development of a unique patent that enhances the monitoring of storage clusters.

Latest Patents

Ryan holds a patent titled "Method and apparatus for presenting status of storage cluster." This patent outlines a method for presenting the status of a storage cluster. It includes monitoring the configuration status of a target node and providing updated information to users when changes occur. This innovation is crucial for improving the efficiency and reliability of storage systems.

Career Highlights

Ryan is currently employed at Emc IP Holding Company LLC, where he continues to work on advancements in storage technology. His expertise in this area has positioned him as a valuable asset to his team and the company.

Collaborations

Ryan has collaborated with talented individuals such as Zhou Huang and Mark Yue Qian. Their combined efforts contribute to the innovative projects at their company.

Conclusion

Ryan Menglei Liang is a prominent figure in the realm of storage technology, with a focus on enhancing the monitoring of storage clusters. His contributions through patents and collaborations reflect his commitment to innovation in this field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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