Chippewa Falls, WI, United States of America

Ryan Hartman

This inventor holds 6 USPTO granted patents and 1 published patent application. Top assignee: Sargento Foods Inc.. Active years: 2019-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ryan Hartman. Retrieved from https://idiyas.com/inventor/ryan-hartman-j5l1krnc

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 6 

% Patents Active = 100.0

Average Co-Inventor Count = 2.8

ph-index = 4

Forward Citations = 42(Granted Patents)


Location History:

  • Plymouth, WI (US) (2019)
  • Chippewa Falls, WI (US) (2021)

Company Filing History:


Years Active: 2019-2021

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6 patents (USPTO):Explore Patents

Title: The Innovative Journey of Ryan Hartman

Introduction

Ryan Hartman is a notable inventor based in Chippewa Falls, Wisconsin. He has made significant contributions to the field of packaging, holding a total of six patents. His work primarily focuses on creating innovative solutions that enhance the functionality and efficiency of food packaging.

Latest Patents

Among his latest inventions is a food package designed to improve the preservation and convenience of food products. This patent reflects his commitment to addressing consumer needs and advancing packaging technology.

Career Highlights

Ryan Hartman is currently employed at Sargento Foods Inc., where he applies his inventive skills to develop new packaging solutions. His career is marked by a dedication to innovation and a passion for improving food safety and quality through better packaging methods.

Collaborations

Throughout his career, Ryan has collaborated with talented coworkers, including Todd Purkey and Jeff Karp. These partnerships have fostered a creative environment that encourages the development of groundbreaking ideas.

Conclusion

Ryan Hartman's contributions to food packaging innovation exemplify his dedication to enhancing consumer experiences. His work continues to influence the industry and inspire future advancements in packaging technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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