Racine, WI, United States of America

Ryan Hankwitz

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Modine Manufacturing Company. Active years: 2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ryan Hankwitz. Retrieved from https://idiyas.com/inventor/ryan-hankwitz

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

 

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2022

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1 patent (USPTO):Explore Patents

Title: Innovations of Ryan Hankwitz

Introduction

Ryan Hankwitz is an accomplished inventor based in Racine, Wisconsin. He has made significant contributions to the field of cooling technology, particularly with his innovative designs that enhance efficiency and performance.

Latest Patents

Ryan holds a patent for a frameless cooling module. This innovative module features a first and a second shroud panel arranged at opposing sides, extending from the front to the back. It includes at least one L-shaped stiffener bracket that connects the panels at an intermediate location, providing structural integrity. Additionally, one or more heat exchangers are strategically placed within the module, secured by the stiffener bracket, optimizing the cooling process.

Career Highlights

Ryan is currently employed at Modine Manufacturing Company, where he applies his expertise in developing advanced cooling solutions. His work has been instrumental in driving innovation within the company and the industry.

Collaborations

Ryan collaborates with talented coworkers, including Allison M Kirklin and Zachary T Ouradnik. Their combined efforts contribute to the success of their projects and the advancement of cooling technologies.

Conclusion

Ryan Hankwitz is a notable inventor whose work in cooling technology exemplifies innovation and creativity. His contributions, particularly the frameless cooling module, highlight his commitment to enhancing efficiency in engineering solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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