Company Filing History:
Years Active: 2017-2023
Title: Ryan Bourlier: Innovator in Brake Disc Technology
Introduction
Ryan Bourlier is a notable inventor based in Elkhart, IN (US). He has made significant contributions to the field of brake disc technology, holding a total of 4 patents. His work focuses on innovative designs that enhance the performance and safety of braking systems.
Latest Patents
Among his latest patents is a brake disc assembly that features a structural core, one or more friction pads, and a plurality of elongated fasteners. The structural core includes two core surfaces and a plurality of pockets extending between these surfaces. Each friction pad is designed with a pad surface and a friction surface opposite the pad surface. The pad surface is configured to contact the core surface, and it includes a plurality of bosses that engage with the pockets to position the friction pads relative to the structural core. Additionally, another patent describes a brake disc assembly with a single continuous core portion and a friction portion made from a carbon composite material. This innovative design allows the core portion to act as a heat sink during braking operations, effectively managing heat generated in the process.
Career Highlights
Ryan Bourlier is currently employed at Honeywell International Inc., where he continues to develop cutting-edge technologies in the automotive sector. His expertise in brake systems has positioned him as a key player in the industry.
Collaborations
Throughout his career, Ryan has collaborated with talented individuals such as William E Pajak and David R Cole. These partnerships have contributed to the successful development of his innovative patents.
Conclusion
Ryan Bourlier's contributions to brake disc technology exemplify his commitment to innovation and safety in automotive engineering. His patents reflect a deep understanding of the complexities involved in braking systems, making him a valuable asset to Honeywell International Inc. and the industry as a whole.