Chicago, IL, United States of America

Russell L Stacy-Ryan

This inventor holds 3 USPTO granted patents and 2 published patent applications. Top assignee: Wm Wrigley Jr Company. Active years: 2011-2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Russell L Stacy-Ryan. Retrieved from https://idiyas.com/inventor/russell-l-stacy-ryan

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 3 

% Patents Active = 100.0

Average Co-Inventor Count = 1.3

ph-index = 3

Forward Citations = 59(Granted Patents)


Location History:

  • Chicago, IL (US) (2011)
  • Oak Park, IL (US) (2016 - 2018)

Company Filing History:


Years Active: 2011-2018

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3 patents (USPTO):Explore Patents

Title: Russell L. Stacy-Ryan: Innovator in Packaging Solutions

Introduction

Russell L. Stacy-Ryan is a notable inventor based in Chicago, IL. He has made significant contributions to the field of packaging, holding a total of 3 patents. His work focuses on creating innovative solutions that enhance product packaging and usability.

Latest Patents

Among his latest patents, Russell has developed a hard shell, multi-article, reclosable package and blister packaging. These inventions reflect his commitment to improving packaging efficiency and consumer convenience.

Career Highlights

Russell is currently employed at the Wm. Wrigley Jr. Company, where he continues to innovate in the packaging sector. His experience and expertise have made him a valuable asset to the company.

Collaborations

Throughout his career, Russell has collaborated with talented individuals such as David Jaggi and Chris Cunningham. These partnerships have contributed to the success of his projects and the advancement of packaging technology.

Conclusion

Russell L. Stacy-Ryan is a dedicated inventor whose work in packaging has led to multiple patents and innovative solutions. His contributions continue to shape the industry and enhance consumer experiences.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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