Company Filing History:
Years Active: 2024
Title: The Innovative Journey of Ruoshuang Huang in Heat Exchanger Technology
Introduction
Ruoshuang Huang is an accomplished inventor based in Farmington, CT, USA, known for his innovative contributions to the field of heat exchanger technology. With a focused approach to invention, he has developed a notable patent that stands out in its engineering design and application.
Latest Patents
Among his intellectual property achievements, Ruoshuang holds a single patent titled "Heat exchanger with aluminum alloy clad tube and method of manufacture." This innovative heat exchanger features a hollow tube that extends from a tube inlet to a tube outlet. The design includes a wall made from a core of a first aluminum alloy with cladding over it made of a second aluminum alloy. The unique aspect of this invention lies in the composition of the second aluminum alloy, which is less noble than the first aluminum alloy and incorporates alloying elements such as tin, indium, or gallium, or combinations thereof. The design ensures efficient fluid flow, with a first fluid flow path along the inner surface of the wall and a second fluid flow path across the outer surface.
Career Highlights
Ruoshuang Huang’s professional career is closely associated with Carrier Corporation, a leading company in the HVAC industry. His work at Carrier demonstrates his commitment to advancing technologies that improve energy efficiency and performance in heating, ventilation, and air conditioning systems.
Collaborations
Throughout his career, Ruoshuang has had the opportunity to collaborate with talented colleagues, including Mary Teresa Lombardo. This teamwork is indicative of the collaborative environment at Carrier Corporation, fostering innovation and allowing inventors like Ruoshuang to thrive.
Conclusion
Ruoshuang Huang's contributions to heat exchanger technology exemplify the essence of innovation in engineering. With his patented invention, he has made significant strides toward enhancing the efficiency of heat transfer mechanisms. As he continues his work at Carrier Corporation, the industry looks forward to his future advancements in the field.