Shanghai, China

Ruo Ting Yang


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Ruo Ting Yang: Innovator in Superconducting Integrated Circuit Design

Introduction

Ruo Ting Yang is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of superconducting integrated circuits. His innovative approach has led to the development of a unique design method that enhances circuit performance.

Latest Patents

Ruo Ting Yang holds a patent for a "Superconducting integrated circuit design method based on placement and routing by different-layer JTLs." This method involves cutting a bias line at a cell data interface of a cell library and reserving a position for a via. It includes placing and arranging cells on a logic cell layer according to a schematic circuit logic diagram. The design connects clock lines of each cell using a JTL and a splitter of the logic cell layer. Additionally, it performs data connections on each cell using JTLs from both transverse and longitudinal routing layers, which are not in the same layer as the logic cell layer. This innovative routing technique significantly improves data transfer between cells.

Career Highlights

Ruo Ting Yang is affiliated with the Chinese Academy of Sciences, where he continues to advance research in superconducting technologies. His work has garnered attention for its potential applications in various electronic systems.

Collaborations

Ruo Ting Yang collaborates with notable colleagues, including Jie Ren and Xiao Ping Gao, who contribute to his research endeavors. Their combined expertise fosters a productive environment for innovation.

Conclusion

Ruo Ting Yang's contributions to superconducting integrated circuit design exemplify the impact of innovative thinking in technology. His patent reflects a significant advancement in the field, showcasing his dedication to enhancing electronic systems.

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