Mabalacat, Philippines

Ruby Ann Dizon Mamangun

This inventor holds 1 USPTO granted patent. Top assignee: Texas Instruments Corporation. Active years: 2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ruby Ann Dizon Mamangun. Retrieved from https://idiyas.com/inventor/ruby-ann-dizon-mamangun

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2020

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1 patent (USPTO):Explore Patents

Title: The Innovations of Ruby Ann Dizon Mamangun

Introduction

Ruby Ann Dizon Mamangun is a notable inventor based in Mabalacat, Philippines. She has made significant contributions to the field of semiconductor technology. Her innovative work has led to the development of a unique semiconductor package that enhances device performance.

Latest Patents

Ruby Ann Dizon Mamangun holds 1 patent for her invention titled "Semiconductor package having a metal barrier." This patent describes a semiconductor device that features a barrier metal layer positioned over a metallization layer, along with an under bump metallurgy layer above the barrier metal layer, and a solder bump situated over the under bump metallurgy layer. This invention is crucial for improving the reliability and efficiency of semiconductor devices.

Career Highlights

Ruby is currently employed at Texas Instruments Corporation, a leading company in the semiconductor industry. Her role involves research and development, where she applies her expertise to create innovative solutions in semiconductor packaging.

Collaborations

Throughout her career, Ruby has collaborated with talented individuals such as Joel Tomas Medina and Armando Tresvalles Clarina, Jr. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Ruby Ann Dizon Mamangun is a pioneering inventor whose work in semiconductor technology has made a significant impact. Her contributions continue to influence the industry and inspire future innovations.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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