Chelmsford, MA, United States of America

Ruben Gonzalez Aldama

This inventor holds 1 USPTO granted patent. Top assignee: Baker Hughes Holdings LLC. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ruben Gonzalez Aldama. Retrieved from https://idiyas.com/inventor/ruben-gonzalez-aldama

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: The Innovations of Ruben Gonzalez Aldama

Introduction

Ruben Gonzalez Aldama is an accomplished inventor based in Chelmsford, MA (US). He has made significant contributions to the field of ultrasonic technology, particularly with his innovative designs that enhance signal processing.

Latest Patents

Ruben holds a patent for an Ultrasonic Bundle System. This invention features ultrasonic probes designed to abate unwanted signal noise. The ultrasonic probe consists of a bundle of rods that sample data at one end and propagate a signal encoding the sampled data to the other end. Each rod in the bundle has a substantially similar length and diameter, ensuring uniformity. Additionally, the probe includes a shell that concentrically surrounds the bundle of rods, which is configured to pack the rods together. The shell also features grooves that help to mitigate a prevailing bulk wave sampled by the first end.

Career Highlights

Ruben is currently employed at Baker Hughes Holdings LLC, where he continues to innovate and develop new technologies. His work has been instrumental in advancing the capabilities of ultrasonic systems, making them more efficient and effective.

Collaborations

Ruben has collaborated with notable colleagues, including Stephen Rehn and Toan Nguyen, who have contributed to his projects and innovations.

Conclusion

Ruben Gonzalez Aldama's work in ultrasonic technology exemplifies the spirit of innovation. His patent for the Ultrasonic Bundle System showcases his commitment to improving signal processing methods. His contributions are valuable to the field and highlight the importance of collaboration in technological advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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