Nes Ziona, Israel

Roy Lubinski

This inventor holds 1 USPTO granted patent and 2 published patent applications and 3 EPO patents. Top assignee: Hp Indigo B.v.. Active years: 2021.

USPTO Granted Patents = 1 

% Patents Active = 100.0

 

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2021

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1 patent (USPTO):Explore Patents

Title: Roy Lubinski: Innovator in Flexible Packaging Technology

Introduction

Roy Lubinski is a notable inventor based in Nes Ziona, IL. He has made significant contributions to the field of flexible packaging technology. His innovative approach has led to the development of a unique process that enhances the performance of packaging materials.

Latest Patents

Roy Lubinski holds a patent for "Immediate and high performance flexible packaging applications using thermal lamination and new primer technology." This patent describes a process for preparing a flexible packaging material by laminating a printed substrate coated with a primer, which comprises poly(acrylic acid) and/or poly(methacrylic acid), with another substrate coated with a thermal active material. This process is conducted at a temperature greater than or equal to 50°C, resulting in a high-performance flexible packaging multilayer material that shows improved shelf-life without requiring a curing stage for intermediate layers. He has 1 patent to his name.

Career Highlights

Roy Lubinski is currently associated with HP Indigo B.V., where he continues to innovate in the field of packaging technology. His work has been instrumental in advancing the capabilities of flexible packaging solutions.

Collaborations

Throughout his career, Roy has collaborated with talented individuals such as Alexander Stolov and Asaf Salant. These collaborations have contributed to the success of his projects and the advancement of technology in the industry.

Conclusion

Roy Lubinski's contributions to flexible packaging technology demonstrate his commitment to innovation and excellence. His patented processes are paving the way for improved packaging solutions in the market.

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