Partille, Sweden

Roy Bergqvist

This inventor holds 1 USPTO granted patent. Top assignee: Telefonaktiebolaget Lm Ericsson (Publ). Active years: 2002.


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2002

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1 patent (USPTO):Explore Patents

Title: Roy Bergqvist: Innovator in Hybrid Circuit Technology

Introduction

Roy Bergqvist is a notable inventor based in Partille, Sweden. He has made significant contributions to the field of hybrid circuit technology. His innovative approach has led to the development of a unique patent that enhances the performance of hybrid circuits.

Latest Patents

Roy Bergqvist holds a patent for "Wire bond compensation - A hybrid circuit and a process for the manufacturing of a hybrid circuit." This invention involves a circuit that includes a component, such as a monolithic integrated circuit (MIC), and a substrate arranged on a common carrier plate. The design features terminals on both the substrate and the component, with a pad mounted on the substrate terminal. This pad extends over the edge of the substrate terminal and faces the terminal of the component. The invention provides a connection with a very low impedance value, which can be produced accurately, reliably, and economically. He has 1 patent to his name.

Career Highlights

Roy Bergqvist is associated with Telefonaktiebolaget LM Ericsson (Publ), a leading telecommunications company. His work at Ericsson has allowed him to focus on advancing hybrid circuit technology, contributing to the company's innovative solutions in the telecommunications sector.

Collaborations

Throughout his career, Roy has collaborated with talented individuals such as Sandro Vecchiattini and Björn Albinsson. These collaborations have fostered a creative environment that has led to significant advancements in their respective fields.

Conclusion

Roy Bergqvist is a distinguished inventor whose work in hybrid circuit technology has made a lasting impact. His innovative patent demonstrates his commitment to enhancing the efficiency and reliability of electronic components.

Profile summary based on public USPTO records.
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