Ness Ziona, Israel

Roy Beeri

This inventor holds 1 USPTO granted patent and 2 published patent applications and 1 EPO patent. Top assignee: Hewlett-Packard Development Company, L.p.. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Roy Beeri. Retrieved from https://idiyas.com/inventor/roy-beeri-xezi8vuk

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

 

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2023

Loading Chart...
Loading Chart...
1 patent (USPTO):Explore Patents

Title: Roy Beeri: Inventor in Substrate Coating Technology.

Introduction

Roy Beeri is an inventor associated with Ness Ziona, Israel. His patent work includes an approach to selectively lifting part of a substrate during a coating process.

Latest Patents

Beeri is associated with 1 patent, titled “Selectively Lifting Substrates.” The invention describes an apparatus that lifts a selected part of a substrate away from a transfer member as the substrate advances through a coating system. This allows one part of the substrate’s width to be coated while the lifted part remains uncoated.

Career Highlights

Beeri’s listed company affiliations include Hewlett-Packard Development Company, L.P., and HP Indigo B.V. His patent reflects work on controlling how substrates interact with coating equipment.

Collaborations

Beeri’s listed coworkers include Daniel Skvirsky and Liora Braun.

Conclusion

Roy Beeri’s patent on selectively lifting substrates addresses precise control of coating across a substrate, connecting his inventive work with his listed affiliations in the printing and technology sector.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…