Ronizan Mohd Salleh

Title: Ronizan Mohd Salleh and Semiconductor Packaging Innovation

Introduction

Ronizan Mohd Salleh is an inventor associated with Infineon Technologies AG in Johor, Malaysia. His listed patent concerns a semiconductor package design that uses metal posts formed from a structured leadframe.

Latest Patents

Salleh is credited with 1 patent: “Semiconductor Package with Metal Posts from Structured Leadframe.” The disclosed method begins with a metal baseplate comprising a planar base section and multiple posts extending upward from its surface. A semiconductor die is mounted on the baseplate, and an insulating mold compound forms an encapsulant around the assembly. The die’s terminals are electrically connected to the metal posts. Removing the base section then leaves package contacts formed by the posts at the encapsulant’s surface.

Career Highlights

The patent reflects work on semiconductor packaging, particularly the formation of electrical contacts through a structured metal baseplate. Salleh’s listed company affiliation is Infineon Technologies AG.

Collaborations

Sock Chien Tey and Keck Tim Ang are identified as Salleh’s coworkers. The provided information does not specify their roles in the patent or whether they collaborated on it.

Conclusion

Ronizan Mohd Salleh’s listed invention addresses semiconductor package construction by using metal posts to create package contacts, highlighting his contribution to packaging technology.