Company Filing History:
Years Active: 2001-2003
Title: Innovations of RongQing Roy Yu
Introduction
RongQing Roy Yu is a notable inventor based in Poughkeepsie, NY (US). He has made significant contributions to the field of electroplating and thin film technology. With a total of 3 patents to his name, his work has had a considerable impact on various industrial applications.
Latest Patents
One of his latest patents is titled "Process and apparatus for electroplating microscopic features uniformly across a large substrate." This invention provides a method for electroplating a film onto a substrate, ensuring uniformity across the plating surface. The process involves using a plating tank with an electroplating bath, an anode, and two cathodes to achieve the desired electroplating results.
Another significant patent is the "Method of making a lamination and surface planarization for multilayer thin film interconnect." This method utilizes a pre-cut or pre-cured film laminated onto a metallized surface to create a smooth dielectric coating. The process includes applying synchronized pressure and heat to ensure uniform curing and gap filling in the thin film module.
Career Highlights
RongQing Roy Yu is currently employed at International Business Machines Corporation (IBM), where he continues to innovate and develop new technologies. His work at IBM has allowed him to explore various aspects of electroplating and thin film applications, contributing to the company's advancements in these fields.
Collaborations
Throughout his career, RongQing has collaborated with talented individuals such as Chandrika Prasad and Suryanarayana Kaja. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.
Conclusion
RongQing Roy Yu's contributions to the fields of electroplating and thin film technology are noteworthy. His patents reflect his commitment to innovation and excellence in engineering. As he continues his work at IBM, his impact on the industry is expected to grow even further.