Shenzhen, China

Rongkun Dai

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Anker Innovations Technology Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Rongkun Dai. Retrieved from https://idiyas.com/inventor/rongkun-dai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

 

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Rongkun Dai - Innovator in Ground Cleaning Technology

Introduction

Rongkun Dai is a notable inventor based in Shenzhen, China. He has made significant contributions to the field of cleaning technology, particularly with his innovative designs that enhance efficiency and functionality.

Latest Patents

Rongkun Dai holds a patent for a ground cleaning device. This device comprises a ground brush, a main body, and a fan. The fan is located inside the main body and features an air inlet and an air outlet. The main body includes a main air outlet channel, a front air outlet channel, and a rear air outlet channel. The design incorporates a switching device that can operate in two states, allowing for versatile cleaning options.

Career Highlights

Throughout his career, Rongkun Dai has worked with Anker Innovations Technology Co., Ltd. and Anker Innovations Technology Co. Ltd. His experience in these companies has contributed to his expertise in developing innovative cleaning solutions.

Collaborations

Rongkun Dai has collaborated with notable colleagues such as Chunhong Li and Guisheng Nong. Their teamwork has fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Rongkun Dai's contributions to the field of ground cleaning technology exemplify his innovative spirit and dedication to improving everyday tools. His patent for a ground cleaning device showcases his ability to merge functionality with advanced design.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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