Shenzhen, China

Ronggang He

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Future Wei Technologies, Inc.. Active years: 2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ronggang He. Retrieved from https://idiyas.com/inventor/ronggang-he

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

 

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2019

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1 patent (USPTO):Explore Patents

Title: Innovations of Ronggang He

Introduction

Ronggang He is a notable inventor based in Shenzhen, China. He has made significant contributions to the field of telecommunications through his innovative patents. His work focuses on enhancing network operations and management.

Latest Patents

Ronggang He holds a patent titled "In-band telemetry with limited extra bytes." This patent describes a method for performing in-band operations, administration, and management (OAM) using fixed bytes. The method involves selecting data packets from a packet flow according to a sampling rate. As a selected packet is processed by a network device, the device's OAM information is inserted into a fixed-length field of each selected packet.

Career Highlights

Throughout his career, Ronggang He has worked with prominent companies in the technology sector. He has been associated with Future Wei Technologies, Inc. and Huawei Technologies Co., Limited. His experience in these organizations has contributed to his expertise in telecommunications and network management.

Collaborations

Ronggang He has collaborated with several professionals in his field, including Wei Wei and Jingjing Zhang. These collaborations have likely enriched his work and led to further innovations.

Conclusion

Ronggang He is a distinguished inventor whose work in telecommunications has led to valuable patents and advancements in network management. His contributions continue to influence the industry and inspire future innovations.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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