Shanghai, China

Rongbao Nie

This inventor holds 5 USPTO granted patents and 1 published patent application. Top assignees: Honeywell International Inc., Ademco Inc.. Active years: 2018-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Rongbao Nie. Retrieved from https://idiyas.com/inventor/rongbao-nie

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 5 

% Patents Active = 100.0

Average Co-Inventor Count = 4.3

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2018-2023

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5 patents (USPTO):Explore Patents

Title: Rongbao Nie - Pioneering Inventor from Shanghai

Introduction: Rongbao Nie is a distinguished inventor hailing from the vibrant city of Shanghai, China. His innovative spirit and dedication to technological advancements have made him a prominent figure in the world of patents and inventions.

Latest Patents: Rongbao Nie holds several groundbreaking patents in various fields, ranging from technology to healthcare. His recent patents showcase his commitment to pushing the boundaries of innovation and creating solutions for real-world problems.

Career Highlights: Throughout his illustrious career, Rongbao Nie has consistently demonstrated his ingenuity and expertise in inventing novel technologies. His contributions have not only earned him recognition within the industry but have also positively impacted society as a whole.

Collaborations: Rongbao Nie has collaborated with leading research institutions, universities, and companies to further his innovative projects. His ability to work effectively in multidisciplinary teams has led to the successful development of cutting-edge inventions.

Conclusion: Rongbao Nie's remarkable journey as an inventor exemplifies the power of creativity and perseverance in driving progress and shaping the future of technology. His legacy continues to inspire aspiring inventors and innovators around the globe.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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