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For the Inventor, By the Inventor

Bloomington, MN, United States of America

Ronald James Jensen

USPTO Granted Patents = 14 

Average Co-Inventor Count = 2.6

ph-index = 9

Forward Citations = 380(Granted Patents)


Company Filing History:

goldMedal11 out of 15,595 
 
Honeywell International Inc.
 patents
silverMedal3 out of 3,645 
 
Honeywell G.m.b.h.
 patents

Years Active: 1995-2013

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14 patents (USPTO):Explore Patents
1. 8459112 - Systems and methods for three dimensional sensors (2013-06-11),
2. 8362607 - Integrated circuit package including a thermally and electrically conductive package lid (2013-01-29),
3. 8354743 - Multi-tiered integrated circuit package (2013-01-15),
4. 7965094 - Packaged die heater (2011-06-21),
5. 7868362 - SOI on package hypersensitive sensor (2011-01-11),
6. 7863720 - Method and system for stacking integrated circuits (2011-01-04),
7. 7700409 - Method and system for stacking integrated circuits (2010-04-20),
8. 7635916 - Integrated circuit package with top-side conduction cooling (2009-12-22),
9. 7095226 - Vertical die chip-on-board (2006-08-22),
10. 6657134 - Stacked ball grid array (2003-12-02),
11. 6027948 - Method to permit high temperature assembly processes for magnetically (2000-02-22),
12. 6005778 - Chip stacking and capacitor mounting arrangement including spacers (1999-12-21),
13. 5998867 - Radiation enhanced chip encapsulant (1999-12-07),
14. 5453701 - Bare die test and burn-in device (1995-09-26),

Title: The Innovative Contributions of Ronald James Jensen

Introduction

Ronald James Jensen is a notable inventor based in Bloomington, MN, with a remarkable portfolio of 14 patents. His work primarily focuses on advancements in sensor technology and integrated circuit packaging, showcasing his expertise in the field of electronics.

Latest Patents

Among his latest patents, Jensen has developed systems and methods for three-dimensional sensors. This innovation involves fabricating a first die with application electronics and aligning it with a second die to create a multi-axis sensor. Additionally, he has patented an integrated circuit package that features a thermally and electrically conductive package lid. This package lid enhances electrical communication within integrated circuits, providing essential connections for power and signals.

Career Highlights

Throughout his career, Jensen has made significant contributions while working for prominent companies such as Honeywell International Inc. and Honeywell G.m.b.h. His experience in these organizations has allowed him to refine his skills and innovate in the field of electronics.

Collaborations

Jensen has collaborated with notable colleagues, including Richard K. Spielberger and David Scheid. These partnerships have likely contributed to the development of his innovative ideas and patents.

Conclusion

Ronald James Jensen's contributions to sensor technology and integrated circuit packaging highlight his role as a leading inventor in the electronics industry. His patents reflect a commitment to innovation and advancement in technology.

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