This inventor holds 1 USPTO granted patent. Top assignee: Tipper Tie, Inc.. Active years: 2017.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2017
Title: The Innovative Contributions of Ronald H Neely, Jr.
Introduction
Ronald H Neely, Jr. is a notable inventor based in Holly Springs, NC (US). He has made significant contributions to the field of packaging systems, particularly through his innovative patent that enhances the efficiency of clipper assemblies.
Latest Patents
Neely holds a patent for "Packaging systems with clip blow off and related clipper assemblies, methods and computer program products." This invention provides clip blow-off pulses of pressurized gas to clip dies using pressurized gas diverted from an onboard knife, gate, and/or punch cylinder/valve during a reset or idle period of a clipping cycle. The technology is particularly suitable for rotating platform systems with circumferentially spaced apart respective clipper stations. The packaging systems include at least one clipper assembly with at least one pulse valve in communication with a pressurized gas supply configured to generate a respective clip blow-off pulse of pressurized gas across a clip die.
Career Highlights
Neely is associated with Tipper Tie, Inc., where he has been able to apply his innovative ideas in practical settings. His work has contributed to advancements in packaging technology, showcasing his ability to merge creativity with engineering.
Collaborations
Throughout his career, Neely has collaborated with talented individuals such as Kuo-Raid Grant Chen and Dennis J May. These partnerships have likely fostered an environment of innovation and creativity, leading to the development of impactful technologies.
Conclusion
Ronald H Neely, Jr. exemplifies the spirit of innovation in the packaging industry. His contributions through patents and collaborations highlight the importance of creativity in engineering solutions.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
