Ron Blake

Title: The Innovations of Ron Blake in Electroplating Technology

Introduction

Ron Blake is an accomplished inventor based in Oxford, CT (US). He has made significant contributions to the field of electroplating, particularly in the manufacture of printed circuit boards. With a total of 2 patents to his name, Blake's work focuses on improving the efficiency and effectiveness of copper electroplating methods.

Latest Patents

Blake's latest patents include a method titled "Complex waveform for electrolytic plating." This innovative approach is designed for copper electroplating in the manufacture of printed circuit boards. The method is particularly useful for filling through-holes and blind micro-vias with copper. It involves several steps, including preparing an electronic substrate, forming through-holes or micro-vias, and electroplating copper using a complex waveform that incorporates pulse reverse plating, DC plating, and synchronous pulse plating. This technique allows for defect-free filling of the micro-vias and through-holes.

Another notable patent is the "Single step electrolytic method of filling through holes in printed circuit boards and other substrates." This method also focuses on copper electroplating and includes steps for preparing the substrate, forming through-holes or micro-vias, and electroplating copper using an acid copper electroplating solution. The solution consists of various components, including a source of copper ions, sulfuric acid, chloride ions, a brightener, a wetter, and a leveler. This method ensures complete metallization of the through-holes and micro-vias.

Career Highlights

Ron Blake is currently employed at Macdermid Enthone GmbH, where he continues to innovate in the field of electroplating technology. His work has been instrumental in advancing the methods used in the manufacturing of printed circuit boards.

Collaborations

Blake has collaborated with notable coworkers, including Carmichael Gugliotti and William J Decesare. Their combined expertise has contributed to the development of advanced electroplating techniques.

Conclusion

Ron Blake's contributions to electroplating technology have significantly impacted the manufacturing processes of printed circuit boards. His innovative methods enhance the efficiency and quality of copper electroplating, showcasing his dedication to advancing this critical field.