Company Filing History:
Years Active: 2024
Title: Innovator Profile: Roman Rudolph
Introduction: Roman Rudolph is a notable inventor based in Kempten, Germany, recognized for his innovation in the field of connecting elements for friction-increasing connections of components. With a focus on creating effective joining methods, Rudolph has contributed significantly to the development of high-performance arrays used in various applications.
Latest Patents: Roman Rudolph holds a patent for a "Process for making a connecting element for the friction-increasing connection of components, and use of a connecting element." This innovative patent describes arrays featuring a support structure and multiple connecting elements. Each connecting element is integrated with at least one holding arm, linking it to the support structure or to other connecting elements. The design includes a metal substrate with joining surfaces on both sides, enhanced by hard particles fixed onto the substrate through a binder layer. This patent outlines not only the production processes for such arrays but also their practical applications.
Career Highlights: As part of the 3M Innovative Properties Company, Roman Rudolph has been at the forefront of advancements in connecting technology. His work focuses on improving the functionality and durability of components across various industries. His innovative approach has earned him recognition among his peers and has positioned him as an expert in the field.
Collaborations: Throughout his career, Rudolph has worked alongside talented colleagues such as Florian T Grimm and Werner Kaufenstein. Their collaborative efforts have helped drive forward-thinking solutions and innovations within the company, fostering a culture of creativity and development.
Conclusion: Roman Rudolph stands out as a key inventor in the domain of component connections, with a strong patent portfolio that reflects his commitment to innovation. His contributions at 3M Innovative Properties Company continue to advance technology and enhance the efficiency of connecting elements in diverse applications.