Santa Monica, CA, United States of America

Roman A Halushka

This inventor holds 2 USPTO granted patents. Top assignee: Hughes Aircraft Company. Active years: 1981-1989.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Roman A Halushka. Retrieved from https://idiyas.com/inventor/roman-a-halushka

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 2.4

ph-index = 2

Forward Citations = 61(Granted Patents)


Company Filing History:


Years Active: 1981-1989

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2 patents (USPTO):Explore Patents

Title: Roman A. Halushka: Connector and Coupling Innovations

Introduction

Roman A. Halushka is an inventor associated with Santa Monica, California, and Hughes Aircraft Company. His two patents address specialized connector and coupling mechanisms.

Latest Patents

Halushka’s patent, “Pressure Compensated Intermodule Towed Array Connector,” describes a fluid path between coupled modules. A normally closed valve opens when the connectors join, allowing fill fluid to flow and equalize underwater pressure at the joint.

His patent, “Mechanical Coupling,” describes non-magnetic male and female sections with interrupted screw portions. A magnetic plunger locks the aligned sections against further rotation, while an external magnet can withdraw the plunger to permit rotation and separation.

Career Highlights

Halushka’s recorded patent work includes two inventions focused on mechanical coupling and pressure management in connected modules. Both designs address how components can be securely joined and deliberately released.

Collaborations

His listed coworkers include Cornelius A. Van Gelder and George A. McGowan. His work is associated with Hughes Aircraft Company.

Conclusion

Roman A. Halushka’s two patents reflect inventive work on pressure-compensated connectors and magnetically secured mechanical couplings.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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