Company Filing History:
Years Active: 2021-2023
Title: Romain Jaillet: Innovator in Electronic Chip Packaging
Introduction
Romain Jaillet is a notable inventor based in Tours, France. He has made significant contributions to the field of electronic chip packaging, holding a total of 2 patents. His work focuses on enhancing the efficiency and functionality of electronic devices through innovative packaging methods.
Latest Patents
Romain Jaillet's latest patents include a method of forming an electronic chip package that features a conductive layer between a chip and a support. This invention involves a device that comprises a support, an electrically-conductive layer covering the support, a semiconductor substrate on the conductive layer, and an insulating casing. Another patent he holds is for an electronic chip package that includes a support and a conductive layer on the support, which also consists of a support, an electrically-conductive layer covering the support, a semiconductor substrate on the conductive layer, and an insulating casing.
Career Highlights
Romain Jaillet is currently employed at STMicroelectronics (Tours) SAS, where he continues to develop innovative solutions in electronic chip packaging. His expertise in this area has positioned him as a valuable asset to the company.
Collaborations
Romain collaborates with Olivier Ory, a fellow innovator in the field. Their combined efforts contribute to the advancement of technology in electronic devices.
Conclusion
Romain Jaillet's contributions to electronic chip packaging demonstrate his commitment to innovation and excellence in technology. His patents reflect a deep understanding of the complexities involved in electronic device design and functionality.