The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 10, 2023
Filed:
Sep. 30, 2021
Applicant:
Stmicroelectronics (Tours) Sas, Tours, FR;
Inventors:
Olivier Ory, Tours, FR;
Romain Jaillet, Tours, FR;
Assignee:
STMICROELECTRONICS (TOURS) SAS, Tours, FR;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 21/78 (2006.01); H01L 29/861 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3114 (2013.01); H01L 21/561 (2013.01); H01L 21/78 (2013.01); H01L 29/861 (2013.01);
Abstract
The invention concerns a device comprising a support, an electrically-conductive layer covering the support, a semiconductor substrate on the conductive layer, and an insulating casing.
Ory, Olivier. (2023). Method of forming electronic chip package having a conductive layer between a chip and a support (U.S. Patent No. 11784104). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11784104
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile