Edina, MN, United States of America

Rolf G Engstrom

This inventor holds 1 USPTO granted patent. Top assignee: E. a. Sween Company. Active years: 1988.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Rolf G Engstrom. Retrieved from https://idiyas.com/inventor/rolf-g-engstrom

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 70(Granted Patents)


Company Filing History:


Years Active: 1988

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1 patent (USPTO):Explore Patents

Title: Rolf G Engstrom: Innovator in Food Packaging Solutions

Introduction

Rolf G Engstrom is a notable inventor based in Edina, MN (US). He has made significant contributions to the field of food packaging, particularly with his innovative designs that enhance the functionality and usability of food products.

Latest Patents

Engstrom holds a patent for a "Package for Expandable Food Product." This invention includes an outer container and an expandable food pouch within the container. The design features a coating on the inside surface of the container that adheres the pouch when exposed to heat. Additionally, the package incorporates a designed fault along the peripheral edge of the pouch to facilitate the controlled release of pressure formed within it.

Career Highlights

Engstrom is associated with E. A. Sween Company, where he applies his expertise in packaging solutions. His work focuses on creating innovative products that meet the evolving needs of consumers in the food industry.

Collaborations

Engstrom collaborates with Douglas M Fincham, contributing to the development of advanced packaging technologies.

Conclusion

Rolf G Engstrom's innovative approach to food packaging has led to the creation of a unique product that enhances the consumer experience. His contributions to the industry are noteworthy and reflect his commitment to innovation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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