Rohn Kenneth Serapio

Title: Rohn Kenneth Serapio: Innovator in Integrated Circuit Packaging

Introduction

Rohn Kenneth Serapio is a notable inventor based in Santa Rosa, Philippines. He has made significant contributions to the field of integrated circuit packaging, particularly with his innovative designs that enhance the functionality and efficiency of electronic components.

Latest Patents

Rohn Kenneth Serapio holds a patent for a "Tapeless leadframe package with exposed integrated circuit die." This invention features a unique design where a first side of the tapeless leadframe package is etched to create a ring-shaped protrusion and a lead protrusion extending from a base layer. The integrated circuit die is mounted in a flip chip orientation, ensuring that the front side faces the first side. This design allows for both electrical and mechanical attachments between the bonding pad of the integrated circuit die and the lead protrusion. Furthermore, the integrated circuit die and the protrusions are encapsulated within an encapsulating block, enhancing the durability and performance of the package.

Career Highlights

Rohn Kenneth Serapio is currently employed at STMicroelectronics GmbH, where he continues to innovate and develop advanced packaging solutions for integrated circuits. His work has been instrumental in improving the reliability and efficiency of electronic devices.

Collaborations

Rohn has collaborated with talented coworkers, including Aaron Cadag and Ela Mia Cadag, contributing to various projects that push the boundaries of technology in the semiconductor industry.

Conclusion

Rohn Kenneth Serapio's contributions to integrated circuit packaging exemplify the spirit of innovation in the electronics field. His patent for the tapeless leadframe package showcases his ability to create solutions that meet the demands of modern technology.