Roger Y B Young

Title: **Roger Y B Young: Pioneer in Wafer Inspection and Edge Bead Removal Technologies**

Introduction

Roger Y B Young, an accomplished inventor based in Vancouver, WA, has made significant contributions to the field of semiconductor manufacturing. Over his career, he has been granted four patents, showcasing his innovative spirit and commitment to advancing technology.

Latest Patents

Among his most recent inventions is a patent for **Wafer Edge Defect Inspection Using Captured Image Analysis**. This method and apparatus enhance integrated circuit fabrication systems by employing an image capturing device that collects images of wafer edges. With a database dedicated to storing and analyzing these images, the system can automatically identify edge defects and assess the performance of the fabrication process, enabling efficient quality control.

Another noteworthy patent from Roger is the **Dynamic Edge Bead Removal** method. This innovative technique involves rotating a substrate while delivering a specific fluid that solvates the coated material. The fluid is directed radially inward on the substrate at controlled speeds and then outward, allowing for precise edge bead removal. This process emphasizes efficiency and accuracy, contributing significantly to the substrate preparation in semiconductor applications.

Career Highlights

Throughout his career, Roger has worked with reputable companies such as LSI Logic Corporation and LSI Corporation. His expertise in manufacturing processes and image analysis has not only bolstered the companies he worked for but has also paved the way for advancements in semiconductor technology.

Collaborations

While working in this dynamic field, Roger has collaborated with fellow innovators, including Bruce Joseph Whitefield and John A Knoch. These partnerships have enriched his work and contributed to the successful development of his patented technologies.

Conclusion

Roger Y B Young exemplifies innovation in the semiconductor industry. Through his patented technologies in wafer inspection and edge bead removal, he continues to impact semiconductor manufacturing positively. His contributions will undoubtedly influence future advancements in this critical field.