Company Filing History:
Years Active: 1987-1992
Title: Innovations of Roger H Higman
Introduction
Roger H Higman is a notable inventor based in Palm Bay, FL (US). He has made significant contributions to the field of semiconductor technology, holding a total of 7 patents. His work focuses on high-speed, high-density semiconductor memory packages, which are crucial for modern electronic devices.
Latest Patents
Higman's latest patents include a method of making a high-speed, high-density semiconductor memory package. This innovative packaging structure mounts integrated circuit chips in a nested, cavity-up configuration, allowing for easy access to the modules for reworkability. Notably, this design eliminates the need for a separate printed circuit board for support and interconnect among the modules. Each monolithic integrated circuit module features a cavity-up leadless chip carrier affixed to a dedicated thermally and electrically conductive mounting base. This base effectively plugs into an underlying ground plane or heat sink support. The design includes a thin conductive plate with a cylindrical stem, which retains the mounting base within an aperture in the underlying support. The support has multiple cylindrical stem engaging apertures arranged in a matrix configuration, ensuring that the mounting bases align edgewise in a tight array. Contact regions along the edge portions of the mounting base connect to conductive traces from topside wirebond links on the chip. Interconnections between chip carriers are facilitated by elastomeric connectors bridging the contact regions of the aligned edges of the mounting bases. Circuit-to-circuit interconnections are achieved through IC chip wiring layers or an additional wiring layer in the chip carrier.
Career Highlights
Roger H Higman has had a distinguished career at Harris Corporation, where he has been instrumental in advancing semiconductor technologies. His innovative approaches have led to the development of cutting-edge memory packages that enhance the performance and reliability of electronic devices.
Collaborations
Throughout his career, Higman has collaborated with talented individuals such as Douglas E Heckaman and Jeffrey A Frisco. These partnerships have contributed to the successful development of his patented technologies.
Conclusion
Roger H Higman is a prominent inventor whose work in semiconductor technology has led to significant advancements in high-speed memory packaging. His contributions continue to influence the electronics industry, showcasing the importance of innovation in technology.