The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 25, 1989

Filed:

Jul. 14, 1987
Applicant:
Inventors:

Douglas E Heckaman, Indialantic, FL (US);

Roger H Higman, Palm Bay, FL (US);

Jeffrey A Frisco, Palm Bay, FL (US);

Edward J Bajgrowicz, Palm Bay, FL (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P / ; H01P / ;
U.S. Cl.
CPC ...
333-1 ; 333236 ; 333243 ;
Abstract

A miniaturized transmission link architecture for intercoupling high frequency miniaturized integrated circuit components comprises a thin conductive plate in one surface of which a matrix or grid work of rectilinear grooves or channels are formed, creating 'waffle-iron'-like pattern in one surface of the conductive plate. The spacing between channels corresponds to the width of a channel which, in turn, may be sized to substantially match the outer diameter of insulation jacketed wire that is placed in the channels. The depth of a channel or groove is slightly larger than the outer diameter of the wire to accommodate wire crossovers at intersections of the channels. The top surface of the 'waffle-plate' is provided with a conductive foil to complete the shielding for the wires. Because the waffle structure has the same periodicity along either of the orthogonal directions of the channels, the characteristic impedance of the transmission link is readily defined by the size of the lands or mesas that are bounded by the channels and the widths of the channels themselves.


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