This inventor holds 1 USPTO granted patent. Top assignee: US Government as Represented by the Secretary of the Army. Active years: 1996.
Company Filing History:
Years Active: 1996
Title: Innovations of Roger B Clough
Introduction
Roger B Clough is an accomplished inventor based in Rockville, MD (US). He has made significant contributions to the field of soldering technology, particularly with his innovative approach to composite solders. His work has implications for various industries, especially in electronics manufacturing.
Latest Patents
Roger B Clough holds a patent for a unique solder composition and method of soldering using composite solders. This invention involves a solder alloy combined with intermetallic filler particles that are lead-free. These particles exhibit high strength, wet and disperse well in solder joints, and remain uniformly distributed. They also resist degradation over long-term aging. By incorporating these intermetallic particles into commercial bulk or paste solders, the lead content in solder joints is reduced, while the mechanical properties of the solder are enhanced. This is achieved by inhibiting localized shear deformation and interfering with crack growth.
Career Highlights
Roger B Clough is currently employed by the US Government as represented by the Secretary of the Army. His role involves applying his expertise in solder technology to support various military applications. His innovative work has not only advanced soldering techniques but has also contributed to the safety and reliability of electronic components used in defense systems.
Collaborations
Roger has collaborated with notable colleagues such as George K Lucey, Jr and James Antoni Wasynczuk. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.
Conclusion
Roger B Clough's contributions to the field of solder technology through his patent on composite solders demonstrate his commitment to innovation. His work continues to influence the industry and improve the quality of solder joints in various applications.
