Henderson, NY, United States of America

Rodney Richmond


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 30(Granted Patents)


Company Filing History:


Years Active: 2000

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Rodney Richmond

Introduction

Rodney Richmond is a notable inventor based in Henderson, NY (US). He has made significant contributions to the field of thermal transfer technology. His innovative work has led to the development of a unique patent that enhances the efficiency of image transfer processes.

Latest Patents

Rodney Richmond holds a patent for an "Ink jet printable support material for thermal transfer." This invention involves a printable transfer material designed for thermal image transfer onto a flat porous surface. The material comprises a base, a release layer, and an image receiving layer that contains a hydrophilic binder, a fine-grained thermoplastic polymer, and silica. This patent showcases his commitment to advancing printing technology.

Career Highlights

Rodney Richmond is associated with Felix Schoeller Technical Papers, Inc., where he applies his expertise in developing innovative materials. His work at the company has been instrumental in creating products that meet the evolving needs of the printing industry. With a focus on quality and performance, he has contributed to the company's reputation for excellence.

Collaborations

Rodney has collaborated with talented individuals such as Hua Cheng and William L Quartz. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas. Together, they have worked on projects that push the boundaries of thermal transfer technology.

Conclusion

Rodney Richmond's contributions to the field of thermal transfer technology are commendable. His patent and work at Felix Schoeller Technical Papers, Inc. reflect his dedication to innovation. Through collaboration with skilled colleagues, he continues to make strides in enhancing printing processes.

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