Bountiful, UT, United States of America

Rodney O Kirby

This inventor holds 2 USPTO granted patents. Top assignee: Harnischfeger Engineers Inc.. Active years: 1995.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Rodney O Kirby. Retrieved from https://idiyas.com/inventor/rodney-o-kirby

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.1

ph-index = 2

Forward Citations = 202(Granted Patents)


Company Filing History:


Years Active: 1995

Loading Chart...
2 patents (USPTO):Explore Patents

Title: Rodney O Kirby: Pioneering Inventor from Bountiful, UT

Introduction: Rodney O Kirby is a distinguished inventor hailing from Bountiful, Utah, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Rodney O Kirby holds several patents in various technological domains, including advancements in renewable energy systems, artificial intelligence algorithms, and medical devices.

Career Highlights: With a career spanning over two decades, Rodney O Kirby has worked with leading tech companies, research institutions, and universities to develop cutting-edge solutions that have revolutionized industries worldwide.

Collaborations: Throughout his career, Rodney O Kirby has collaborated with top engineers, scientists, and researchers to bring his innovative ideas to life. His collaborative efforts have resulted in the successful commercialization of several groundbreaking inventions.

Conclusion: Rodney O Kirby's passion for innovation and his relentless pursuit of excellence have solidified his reputation as a visionary inventor in the technology sector. His contributions continue to inspire the next generation of inventors and shape the future of technological advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…