York, PA, United States of America

Rodney Grove

This inventor holds 1 USPTO granted patent. Top assignee: Amphenol Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Rodney Grove. Retrieved from https://idiyas.com/inventor/rodney-grove

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Rodney Grove: Innovator in Processor Socket Technology

Introduction

Rodney Grove is a notable inventor based in York, PA (US). He has made significant contributions to the field of processor socket hardware. His innovative designs focus on enhancing the performance and reliability of processor socket assemblies.

Latest Patents

Rodney Grove holds a patent for a "Compliant pressure lid for processor socket hardware." This invention addresses the need for uniform compression across the contact field of processor socket assemblies. The compliant lids he has developed ensure that compression uniformity is maintained, even as the physical dimensions of sockets and the density of contacts continue to increase. By relocating the pressure exerted on the package away from the corners, his design enhances performance without relying on complex components.

Career Highlights

Rodney Grove is associated with Amphenol Corporation, where he applies his expertise in developing innovative solutions for processor socket technology. His work has been instrumental in advancing the design and functionality of socket assemblies.

Collaborations

Rodney collaborates with his coworker, Paul R Taylor, to further enhance the innovations in their field. Their combined efforts contribute to the ongoing development of cutting-edge technologies.

Conclusion

Rodney Grove's contributions to processor socket technology exemplify the importance of innovation in the tech industry. His patent for compliant pressure lids showcases his commitment to improving product performance and reliability.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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