Portland, OR, United States of America

Roberto M Aimi

This inventor holds 1 USPTO granted patent and 1 published patent application and 1 EPO patent. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Roberto M Aimi. Retrieved from https://idiyas.com/inventor/roberto-m-aimi-5p8fm4p0

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

 

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2017

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Roberto M Aimi

Introduction

Roberto M Aimi is a notable inventor based in Portland, OR (US). He has made significant contributions to the field of packaging technology. His innovative approach has led to the development of a unique package system that enhances functionality and efficiency.

Latest Patents

Roberto holds a patent for a "Package system with cover structure and method of operation thereof." This patent describes a package system that includes an exostructure, a ceramic panel attached to the exostructure, and an internal device component housed within the exostructure. This invention showcases his ability to integrate materials and design for improved packaging solutions.

Career Highlights

Roberto is currently employed at Samsung Electronics Co., Ltd., where he continues to push the boundaries of innovation. His work at such a prestigious company highlights his expertise and the value he brings to the field of technology and packaging.

Collaborations

Throughout his career, Roberto has collaborated with talented individuals such as Justin Lawrence Gregg and Michael Nathaniel Rosenblatt. These partnerships have likely contributed to the success of his projects and the advancement of their collective work.

Conclusion

Roberto M Aimi is a distinguished inventor whose work in packaging technology has made a significant impact. His patent and contributions at Samsung Electronics Co., Ltd. reflect his commitment to innovation and excellence in his field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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