This inventor holds 1 USPTO granted patent. Top assignee: The United States of America as Represented by the United States. Active years: 1993.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1993
Title: The Innovative Contributions of Robert W. Petersen
Introduction
Robert W. Petersen is a notable inventor based in Pleasanton, California. He has made significant contributions to the field of multi-chip modules, showcasing his expertise and innovative spirit. His work has led to the development of advanced technologies that enhance the performance and efficiency of electronic devices.
Latest Patents
Petersen holds a patent for a three-dimensional, multi-chip module. This invention involves stacking a plurality of multi-chip modules that are bonded around the perimeter by sold-bump bonds to adjacent modules on three sides. The fourth side is designed for coolant distribution or additional interconnect structures, depending on the specific design considerations of the chip set. The multi-chip modules consist of a circuit board with a planarized interconnect structure on a first major surface, along with integrated circuit chips bonded to this surface. Additionally, long, narrow 'dummy chips' are bonded around the periphery of each circuit board to create a perimeter wall, which is higher than any of the chips on the board. This design ensures that the flat back surface of the board only touches the perimeter wall. Module-to-module interconnect is laser-patterned on the sides of the boards and over the perimeter wall simultaneously with chip-to-board interconnect.
Career Highlights
Petersen's career is marked by his dedication to advancing technology in the electronics sector. His innovative approach to multi-chip modules has positioned him as a key figure in the industry. He works for the United States of America as represented by the United States, contributing to various projects that aim to improve electronic systems.
Collaborations
Petersen has collaborated with Anthony F. Bernhardt, working together to push the boundaries of technology in their field. Their partnership has led to the development of groundbreaking solutions that address complex challenges in electronics.
Conclusion
Robert W. Petersen's contributions to the field of multi-chip modules exemplify his innovative mindset and commitment to technological advancement. His patent for a three-dimensional, multi-chip module highlights his ability to create solutions that enhance electronic performance. Through his work and collaborations, Petersen continues to make a significant impact in the world of technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
