Robert W Knoll

Title: Innovations by Robert W. Knoll

Introduction

Robert W. Knoll is an accomplished inventor based in Menomonee Falls, WI (US). He has made significant contributions to the field of materials science, particularly in the development of films used in microelectronic packaging. With a total of 3 patents, his work has paved the way for advancements in the industry.

Latest Patents

Knoll's latest patents include "Thick, low-stress films, and coated substrates formed therefrom" and "Stress-induced deformation, and the damage resulting therefrom, increases with film thickness." These innovations address the challenges associated with film thickness and stress in microelectronic applications. The use of Si-Al-N film material allows for the creation of thick films necessary for various applications, particularly in microelectronic packaging on silicon substrates. These films exhibit excellent adherence to substrates, high hardness, durability, and outstanding insulating properties. Notably, Knoll's process operates under non-elevated temperature conditions, typically at 500°C or less, overcoming limitations of prior art elevated temperature deposition processes.

Career Highlights

Robert W. Knoll has had a distinguished career at Battelle Memorial Institute, where he has been instrumental in advancing research and development in materials science. His innovative approaches have led to significant improvements in the performance and reliability of microelectronic components.

Collaborations

Throughout his career, Knoll has collaborated with notable colleagues, including Charles H. Henager, Jr. and Martin D. Merz. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Robert W. Knoll's contributions to the field of materials science, particularly through his patents on thick, low-stress films, have had a profound impact on microelectronic packaging. His work continues to influence the industry and drive advancements in technology.