Carlisle, PA, United States of America

Robert S Vanderzee

This inventor holds 1 USPTO granted patent. Top assignee: Carlisle Corporation. Active years: 1987.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Robert S Vanderzee. Retrieved from https://idiyas.com/inventor/robert-s-vanderzee-ldxf8bm1

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 1.0

ph-index = 1

Forward Citations = 17(Granted Patents)


Company Filing History:


Years Active: 1987

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Robert S Vanderzee

Introduction

Robert S Vanderzee is a notable inventor based in Carlisle, PA (US). He has made significant contributions to the field of material bonding through his innovative patent. His work exemplifies the spirit of invention and the pursuit of practical solutions in engineering.

Latest Patents

Vanderzee holds a patent for a "Longitudinal seam and method of forming." This patent describes a seam wherein two sheets of material are bonded together to form one unified sheet. The edges of each sheet are designed with a stepped portion on one side and a flat surface on the opposite side. The planar or stepped surfaces of the two edges are joined together to create a seam that maintains a thickness no greater than one and one-half times the thickness of the sheet material. This method is particularly useful for forming a longitudinal seam in a roll of sheet material. He has 1 patent to his name.

Career Highlights

Vanderzee is associated with Carlisle Corporation, where he applies his expertise in material science and engineering. His role at the company allows him to contribute to innovative projects that enhance product quality and performance.

Conclusion

Robert S Vanderzee's inventive work in bonding materials showcases his commitment to innovation and engineering excellence. His contributions continue to impact the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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