This inventor holds 3 USPTO granted patents. Top assignees: Alliedsignal Inc., Allied Corporation. Active years: 1986-1992.
Company Filing History:
Years Active: 1986-1992
Title: The Innovative Contributions of Robert P. Kane
Introduction
Robert P. Kane is a notable inventor based in Camillus, NY (US). He has made significant contributions to the field of electrical engineering, particularly in the development of methods for creating printed circuit boards. With a total of 3 patents to his name, Kane's work has had a lasting impact on the industry.
Latest Patents
Kane's latest patents focus on innovative methods for making printed circuit boards. One of his inventions describes a method for creating an electrically conductive path on the wall of a passage through a substrate. This method is particularly useful for connecting conductive paths on opposite sides of a circuit board. The process involves forming a tapered passage through the substrate, filling it with electrically conductive powder, applying pressure to compact the powder, and then heating it to enhance conductivity and adhesion without damaging the substrate. Another patent outlines a similar method for providing an electrically conductive path through a substrate, emphasizing the importance of maintaining the integrity of the substrate while ensuring effective electrical connections.
Career Highlights
Throughout his career, Robert P. Kane has worked with prominent companies such as AlliedSignal Inc. and Allied Corporation. His experience in these organizations has contributed to his expertise in the field of electrical engineering and patent development.
Collaborations
Kane has collaborated with notable individuals in his field, including Edwin D. Lillie and Bruce E. Kurtz. These collaborations have likely enriched his work and contributed to the innovative solutions he has developed.
Conclusion
Robert P. Kane's contributions to the field of electrical engineering, particularly in the area of printed circuit board technology, demonstrate his innovative spirit and dedication to advancing the industry. His patents reflect a commitment to improving electrical connectivity while maintaining the integrity of substrates.