Enola, PA, United States of America

Robert Lee Putt, Jr


Average Co-Inventor Count = 4.2

ph-index = 2

Forward Citations = 91(Granted Patents)


Company Filing History:


Years Active: 2014

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2 patents (USPTO):Explore Patents

Title: The Innovations of Robert Lee Putt, Jr.

Introduction

Robert Lee Putt, Jr. is an accomplished inventor based in Enola, PA (US). He has made significant contributions to the field of cable assembly and connector technology. With a total of 2 patents to his name, Putt has demonstrated a commitment to innovation and engineering excellence.

Latest Patents

Putt's latest patents include a cable assembly and connector module that features a drain wire and a ground ferrule that are laser-welded together. This innovative cable assembly includes a communication cable with insulated conductors, a shielding layer, and a drain wire extending along the shielding layer. The ground ferrule is coupled to the terminating end of the cable and is intimately engaged with the drain wire, ensuring a robust connection. Another notable patent is the cable header connector, which comprises a cable with a pair of signal wires and a contact sub-assembly. This design provides electrical shielding for the contact sub-assembly and ensures that the signal contacts are securely laser-welded to the signal wires.

Career Highlights

Putt is currently employed at Tyco Electronics Corporation, where he continues to develop innovative solutions in the field of electronics. His work has significantly impacted the industry, particularly in the area of cable assemblies and connectors.

Collaborations

Throughout his career, Putt has collaborated with talented individuals such as Julia Anne Lachman and John Eugene Westman. These partnerships have fostered a creative environment that encourages innovation and problem-solving.

Conclusion

Robert Lee Putt, Jr. is a notable inventor whose work in cable assembly and connector technology has led to significant advancements in the field. His patents reflect a deep understanding of engineering principles and a dedication to improving electronic connectivity.

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