Robert J Landman

Title: The Innovations of Robert J. Landman

Introduction

Robert J. Landman is a notable inventor based in North Hampton, NH (US). He has made significant contributions to the field of electronics, particularly in addressing the challenges posed by tin whiskers in electronic circuits. His innovative approach has led to the development of a unique patent that enhances the reliability of electronic assemblies.

Latest Patents

Robert J. Landman's most recent patent is titled "Selective application by electroless plating of a tin-whisker impenetrable metal cap to metals on electronic assemblies." This invention addresses the issue of tin whiskers that can short out electronic circuits, especially in the context of lead-free tin solders. The patent outlines a method for depositing a metal cap on exposed tin-coated surfaces, effectively preventing the growth of whiskers that can compromise circuit functionality.

Career Highlights

Throughout his career, Robert has been associated with LDF Coatings, LLC, where he has applied his expertise in materials science and engineering. His work has been instrumental in developing solutions that enhance the durability and performance of electronic components. With a focus on innovation, he has successfully navigated the complexities of modern electronics manufacturing.

Collaborations

Robert has collaborated with several professionals in his field, including J. Gordon Davy and Dennis Fritz. These partnerships have fostered a collaborative environment that encourages the exchange of ideas and the development of cutting-edge technologies.

Conclusion

Robert J. Landman's contributions to the field of electronics through his innovative patent demonstrate his commitment to improving the reliability of electronic circuits. His work continues to influence the industry, paving the way for advancements in electronic assembly technology.