Company Filing History:
Years Active: 1994
Title: The Innovations of Robert J Heideman
Introduction
Robert J Heideman is a notable inventor based in Galveston, Indiana. He has made significant contributions to the field of semiconductor technology. His work primarily focuses on improving the performance and durability of integrated circuits.
Latest Patents
Heideman holds a patent for a multilayer metallization system designed for silicon semiconductor devices. This innovative aluminum-containing metallization system is particularly useful for integrated circuits (ICs) that have P-type contact regions. It addresses the challenges posed by extended exposure to elevated temperatures. The patent describes the use of an aluminum/silicon diffusion barrier formed of amorphous tungsten/silicon, making it commercially practical for ICs. Additionally, a titanium or transition metal silicide layer is placed beneath the amorphous tungsten/silicon layer to ensure durable low-resistance electrical contacts to the P-type regions of the IC.
Career Highlights
Heideman is associated with Delco Electronics Corporation, where he has contributed to various projects in semiconductor technology. His expertise has been instrumental in advancing the capabilities of electronic devices.
Collaborations
Heideman has worked alongside talented colleagues such as Randy A Rusch and Michael S Baird. Their collaborative efforts have further enhanced the innovations in the field of electronics.
Conclusion
Robert J Heideman's contributions to semiconductor technology exemplify the impact of innovative thinking in the electronics industry. His patent reflects a commitment to improving the functionality and reliability of integrated circuits.