Warren, PA, United States of America

Robert J Eames

This inventor holds 1 USPTO granted patent. Top assignee: Gte Products Corporation. Active years: 1986.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Robert J Eames. Retrieved from https://idiyas.com/inventor/robert-j-eames

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 1986

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1 patent (USPTO):Explore Patents

Title: The Innovations of Robert J Eames

Introduction

Robert J Eames is a notable inventor based in Warren, PA (US). He has made significant contributions to the field of integrated circuit packaging. His innovative approach has led to the development of a unique patent that enhances the reliability of electronic components.

Latest Patents

Robert J Eames holds a patent for an integrated circuit package. This invention features a cover that includes a groove with a quadrangular cross-section. The groove contains a self-supporting sealant material of a similar cross-section. During assembly, the sealant material is penetrated by the lead-ins, allowing it to flow around them. This process achieves an environmental seal for the packaged chip, ensuring its durability and performance.

Career Highlights

Eames is associated with GTE Products Corporation, where he has applied his expertise in electronics and materials science. His work has contributed to advancements in the manufacturing and packaging of integrated circuits. His innovative designs have played a crucial role in improving the efficiency and reliability of electronic devices.

Collaborations

Robert J Eames has worked alongside Richard E Johnson, collaborating on various projects within the company. Their combined efforts have led to significant advancements in the field of integrated circuit technology.

Conclusion

Robert J Eames is a distinguished inventor whose work in integrated circuit packaging has made a lasting impact on the electronics industry. His innovative patent demonstrates his commitment to enhancing the reliability of electronic components.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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