Sterling Heights, MI, United States of America

Robert J Bednarz

This inventor holds 1 USPTO granted patent. Top assignee: Tocco, Inc.. Active years: 1988.


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 44(Granted Patents)


Company Filing History:


Years Active: 1988

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1 patent (USPTO):Explore Patents

Title: Innovations of Robert J Bednarz in Induction Heating Technology

Introduction

Robert J Bednarz is an accomplished inventor based in Sterling Heights, MI (US). He has made significant contributions to the field of adhesive bonding through his innovative patent. His work focuses on enhancing the bonding process between structural members using advanced induction heating techniques.

Latest Patents

Robert J Bednarz holds a patent for a method and apparatus titled "Induction heating for adhesive bonding." This invention provides an improved bond between two structural members by utilizing spherical particles, preferably graded steel shot, within the adhesive. These particles facilitate an accurate space between the opposing face surfaces of the structural members as they are brought into pressured contact. An induction coil is employed to heat the spherical particles, establishing a heat source that thermally sets the adhesive from within the gap created by the particles. This innovative approach enhances the efficiency and effectiveness of adhesive bonding.

Career Highlights

Throughout his career, Robert has demonstrated a commitment to advancing technology in adhesive bonding. His work at Tocco, Inc. has allowed him to apply his inventive ideas in practical applications, contributing to the company's reputation for innovation in the industry.

Collaborations

Robert has collaborated with his coworker, Donald E Novorsky, to further develop and refine his inventions. Their teamwork has played a crucial role in the successful implementation of their innovative ideas.

Conclusion

Robert J Bednarz's contributions to induction heating technology for adhesive bonding exemplify the impact of innovation in engineering. His patent reflects a significant advancement in the field, showcasing his dedication to improving bonding techniques.

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