Endwell, NY, United States of America

Robert G Rickert


Average Co-Inventor Count = 2.2

ph-index = 6

Forward Citations = 74(Granted Patents)


Location History:

  • Johnson City, NY (US) (1987)
  • Endwell, NY (US) (1986 - 1990)

Company Filing History:


Years Active: 1986-1990

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8 patents (USPTO):

Title: The Innovations of Robert G. Rickert

Introduction

Robert G. Rickert is a notable inventor based in Endwell, NY (US). He has made significant contributions to the field of electroless plating, holding a total of 8 patents. His work has advanced the technology used in various industrial applications, particularly in the electronics sector.

Latest Patents

One of Rickert's latest patents is titled "Copper deposition from electroless plating bath." This invention describes a method where copper is deposited onto a substrate by plating a first layer of copper from an electroless plating bath, followed by a second layer from a different electroless plating bath. The two baths differ in cyanide content, which helps reduce plating void defects and nodule formation. Another significant patent is the "Method for controlling plating on seeded surfaces." This method involves preparing and maintaining an electroless plating bath for seeded surfaces, which include a palladium and tin coating. The conditions of the plating bath are monitored by measuring the open circuit potential, allowing for adjustments that optimize the electroless plating process.

Career Highlights

Robert G. Rickert is currently employed at International Business Machines Corporation (IBM), where he continues to innovate and develop new technologies. His work has been instrumental in enhancing the efficiency and effectiveness of electroless plating processes.

Collaborations

Rickert has collaborated with several notable coworkers, including Donald G. McBride and Ronald A. Kaschak. Their combined expertise has contributed to the successful development of various patents and innovations in the field.

Conclusion

Robert G. Rickert's contributions to electroless plating technology have made a significant impact on the industry. His innovative patents and ongoing work at IBM continue to push the boundaries of what is possible in this field.

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