The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 27, 1990

Filed:

Jan. 20, 1987
Applicant:
Inventors:

Peter A Burnett, Endicott, NY (US);

Dae Y Jung, Endwell, NY (US);

Ronald A Kaschak, Vestal, NY (US);

Roy H Magnuson, Binghamton, NY (US);

Robert G Rickert, Endwell, NY (US);

Stephen L Tisdale, Vestal, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05D / ;
U.S. Cl.
CPC ...
4274431 ; 427304 ; 427305 ;
Abstract

Copper is deposited onto a substrate by plating a first layer of copper onto the substrate from an electroless plating bath and plating a second layer of copper onto the first layer of copper from a second and different electroless plating bath. The first and second plating baths differ from each other in at least the cyanide content. The process reduces plating void defects and reduces nodule formation.


Find Patent Forward Citations

Burnett, Peter. (1990). Copper deposition from electroless plating bath (U.S. Patent No. 4904506). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4904506

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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