This inventor holds 1 USPTO granted patent. Top assignee: Visteon Global Technolgoies, Inc.. Active years: 2001.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2001
Title: Robert Emmett Murray: Innovator in Electronic Module Testing
Introduction
Robert Emmett Murray is a notable inventor based in Livonia, MI (US). He has made significant contributions to the field of electronic module testing, particularly in the durability of solder joints under thermal stress. His innovative approach has implications for improving the reliability of electronic devices.
Latest Patents
Murray holds a patent for a "Method for specifying accelerated thermal cycling tests for electronic solder joint durability." This patent outlines a method for testing electronic modules to evaluate solder joint failures caused by thermally induced stress. The process involves determining a thermal shock endurance test profile that reflects field temperature conditions, estimating the time and cycles to failure of solder joints using numerical simulation techniques, and selecting a design life duration for the module. The method also includes comparing the design life duration with the estimated time to failure of the weakest solder joint, ultimately leading to the determination of an accelerated thermal shock endurance test specification.
Career Highlights
Robert Emmett Murray is currently employed at Visteon Global Technologies, Inc. His work focuses on enhancing the durability and reliability of electronic components, which is crucial in today's technology-driven world. His innovative methods have the potential to significantly reduce failures in electronic devices, thereby improving overall product performance.
Collaborations
Murray has collaborated with notable colleagues such as Jacob Frimenko and George Albert Garfinkel. These collaborations have likely contributed to the advancement of his research and the successful development of his patented methods.
Conclusion
Robert Emmett Murray's contributions to the field of electronic module testing exemplify the importance of innovation in enhancing product reliability. His patented methods provide valuable insights into the durability of solder joints, which is essential for the advancement of electronic technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile