This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Structural Integrity Associates, Inc.. Active years: 2025.
Company Filing History:
Years Active: 2025
Title: The Innovations of Robert Edward Chambers, III
Introduction
Robert Edward Chambers, III is an accomplished inventor based in Bloomsburg, PA. He has made significant contributions to the field of ultrasonic technology, particularly through his innovative patent related to thick-film transducer arrays. His work has implications for various applications, including medical imaging and industrial testing.
Latest Patents
Chambers holds a patent for "Thick-film transducer arrays and control field." This invention provides a method for fabricating and controlling a thick-film transducer array, which is essential for steering and focusing ultrasonic waves within a substrate volume. The process involves coating a ceramic film composition on a substrate in multiple layers, masking it with a plastic sheet to create an electrode pattern, and applying conductive material to form the transducer array. This array can be polarized with an electric field, allowing for the generation of wavefields that can be reflected and analyzed to produce images of the substrate volume.
Career Highlights
Chambers is currently employed at Structural Integrity Associates, Inc., where he continues to develop and refine his innovative technologies. His expertise in ultrasonic applications has positioned him as a valuable asset in his field.
Collaborations
Throughout his career, Chambers has collaborated with notable colleagues, including Jason K. Van Velsor and Owen Michael Malinowski. These partnerships have fostered a collaborative environment that enhances the development of cutting-edge technologies.
Conclusion
Robert Edward Chambers, III exemplifies the spirit of innovation through his work on thick-film transducer arrays. His contributions to ultrasonic technology are paving the way for advancements in various industries.