Mount Laurel, NJ, United States of America

Robert E Kuffel

This inventor holds 1 USPTO granted patent. Top assignee: Lockheed Martin Corporation. Active years: 2004.


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2004

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1 patent (USPTO):Explore Patents

Title: The Innovations of Robert E. Kuffel

Introduction

Robert E. Kuffel is an accomplished inventor based in Mount Laurel, NJ (US). He has made significant contributions to the field of high-density interconnected modules, particularly in the realm of radio-frequency and digital processing circuits. His innovative approach has led to the development of a patented technology that addresses challenges related to radiated interference.

Latest Patents

Kuffel holds a patent for an HDI module with an integral conductive electromagnetic shield. This invention outlines a method for creating high-density interconnected modules that are essential for circuits susceptible to radiated interference. The process involves applying sets of semiconductor chips to specific regions on a flexible insulating substrate. Conductive planar walls are then positioned over the chips, with a through aperture designed to fit around them. This innovative encapsulation method ensures that the chips are protected while allowing for effective interconnections.

Career Highlights

Robert E. Kuffel is currently employed at Lockheed Martin Corporation, where he continues to push the boundaries of technology in his field. His work has not only advanced the capabilities of electronic modules but has also contributed to the overall progress of the industry. Kuffel's dedication to innovation is evident in his meticulous approach to problem-solving and design.

Collaborations

Throughout his career, Kuffel has collaborated with notable colleagues, including Gary H. Yan and Philip Paul Kraft. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Robert E. Kuffel's contributions to the field of high-density interconnected modules exemplify the spirit of innovation. His patented technology not only addresses critical challenges in electronic design but also showcases his commitment to advancing the industry. Kuffel's work at Lockheed Martin Corporation and his collaborations with esteemed colleagues further highlight his impact on the field.

Profile summary based on public USPTO records.
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